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Using the evaluation sequence shown in Section 3.3:
c12x2
= c12 * Tadc
= 0.00086665 * 513
= 0.44459
a1
= b1 + c12x2 = -2.49512 + 0.44459
= -2.05052
a1x1
y1
a2x2
= a1 * Padc
= a0 + a1x1
= b2 * Tadc
= -2.05052 * 415
= 2107.875 + (-850.96785)
= -1.02069 * 513
= -850.96785
= 1256.90715
= -523.61444
PComp = y1 + a2x2
= 1256.90715 + (-523.61444) = 733.29270
---------------------- + 50
---------------------- + 50
Pressure (kPa) = P comp
= 733.29
?
?
115 – 50
1023
115 – 50
1023
= 96.59kPa
4
1.
2.
Solder Recommendations
Use SAC solder alloy (i.e., Sn-Ag-Cu) with a melting point of about 217°C. It is recommended to use SAC305
(i.e., Sn-3.0 wt.% Ag-0.5 wt.% Cu).
Reflow
?
?
?
?
?
?
Ramp up rate: 2 to 3°C/s.
Preheat flat (soak): 110 to 130s.
Reflow peak temperature: 250 ° C to 260°C (depends on exact SAC alloy composition).
Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/quantities in the reflow).
Ramp down: 5 to 6°C/s.
Using an inert reflow environment (with O 2 level about 5 to 15 ppm).
NOTE: The stress level and signal offset of the device also depends on the board type, board core material, board thickness
and metal finishing of the board.
MPL115A1
Sensors
Freescale Semiconductor, Inc.
11
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